Tools

LEADER 02943nam 2200409 i 4500

001 ocm03388172;

003 OCoLC;

005 20221216174016.0;

008 771102s1971 dcua b f000 0 eng d;

049 a| ERE#;

074 a| 0249-A;

086 0 a| C 13.46:573;

100 1 a| Harman, George G.=| ^A598116;

245 10 a| Application of capacitor microphones and magnetic pickups to the tuning and trouble shooting of microelectronic ultrasonic bonding equipment /c| George G. Harman and Herbert K. Kessler.;

264 1 a| [Washington, D.C.] :b| National Bureau of Standards,c| 1971.;

300 a| ii, 22 pages :b| illustrations ;c| 26 cm;

336 a| textb| txt2| rdacontent;

337 a| unmediatedb| n2| rdamedia;

338 a| volumeb| nc2| rdacarrier;

490 1 a| NBS technical note ;v| 573;

500 a| Issued May 1971.;

504 a| Includes bibliographical references (page 21).;

505 0 a| Introduction -- Capacitor microphone -- Procedure for reestablishing vibration amplitude, tuning, and diagnosing troubles in ultrasonic wire bonding machines, using a capacitor microphone -- Magnetic pickups for tuning and establishing vibration amplitude of ultrasonic wire bonding equipment -- Appendix. Interferometer calibration of bonding tool tip motion.;

520 a| Microelectronic ultrasonic wire bonding equipment typically welds wires to integrated circuits at frequencies between 50 and 65 kHz. Mechanical vibrations at these frequencies are difficult to measure directly and malfunctions of the system may not be recognized. Two different methods of measuring these vibrations are described. The first method involves use of a capacitor microphone and a tapered tip, and the second method use of a small magnetic pickup. Procedures are given for establishing a specific ultrasonic vibration amplitude, tuning the ultrasonic system to resonance, and diagnosing both mechanical and electrical problems in wire bonding equipment. Although these techniques and procedures were developed for ultrasonic wire bonding equipment, they are applicable to other ultrasonic welding systems of lead attachment, such as flip-chip, beam lead and spider bonding.;

500 a| GPO Historic Shelflist Project- publication not in hand.;

500 a| GPO Cataloging Record Distribution Program (CRDP).;

650 0 a| Ultrasonic weldingx| Testing.=| ^A598117;

650 0 a| Electrostatic microphone.=| ^A604251;

650 7 a| Electrostatic microphone.2| fast0| (OCoLC)fst00907759;

700 1 a| Kessler, Herbert K.,e| author.=| ^A1480516;

710 1 a| United States.b| National Bureau of Standards.=| ^A44678;

830 0 a| NBS technical note ;v| 573.=| ^A4336;

949 a| C 13.46:573w| sudoch| joyner38;

596 a| 1;

998 a| 1008601;

999 a| C 13.46:573w| SUDOCc| 1i| 30372012776420d| 9/6/2005l| JDOSm| JOYNERr| Ys| Yt| JDOSBKu| 9/6/2005x| BOOKz| JFEDDOCSo| .STAFF. 0;

Application of capacitor microphones and magnetic pickups to the tuning and trouble shooting of microelectronic ultrasonic bonding equipment / George G. Harman and Herbert K. Kessler.

Author/creator	Harman, George G.
Other author	Kessler, Herbert K., author.
Other author	United States. National Bureau of Standards.
Format	Book
Publication	[Washington, D.C.] : National Bureau of Standards, 1971.
Description	ii, 22 pages : illustrations ; 26 cm
Subjects	Ultrasonic welding--Testing. Electrostatic microphone.

Series	NBS technical note ; 573 NBS technical note ; 573. ^A4336
Contents	Introduction -- Capacitor microphone -- Procedure for reestablishing vibration amplitude, tuning, and diagnosing troubles in ultrasonic wire bonding machines, using a capacitor microphone -- Magnetic pickups for tuning and establishing vibration amplitude of ultrasonic wire bonding equipment -- Appendix. Interferometer calibration of bonding tool tip motion.
Abstract	Microelectronic ultrasonic wire bonding equipment typically welds wires to integrated circuits at frequencies between 50 and 65 kHz. Mechanical vibrations at these frequencies are difficult to measure directly and malfunctions of the system may not be recognized. Two different methods of measuring these vibrations are described. The first method involves use of a capacitor microphone and a tapered tip, and the second method use of a small magnetic pickup. Procedures are given for establishing a specific ultrasonic vibration amplitude, tuning the ultrasonic system to resonance, and diagnosing both mechanical and electrical problems in wire bonding equipment. Although these techniques and procedures were developed for ultrasonic wire bonding equipment, they are applicable to other ultrasonic welding systems of lead attachment, such as flip-chip, beam lead and spider bonding.
General note	Issued May 1971.
General note	GPO Historic Shelflist Project- publication not in hand.
General note	GPO Cataloging Record Distribution Program (CRDP).
Bibliography note	Includes bibliographical references (page 21).
GPO item number	0249-A
Govt. docs number	C 13.46:573

Application of capacitor microphones and magnetic pickups to the tuning and trouble shooting of microelectronic ultrasonic bonding equipment / George G. Harman and Herbert K. Kessler.

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