Tools

LEADER 02929nam 2200457 i 4500

001 ocm03473365;

003 OCoLC;

005 20230124155748.0;

008 771208s1973 dcua b f000 0 eng d;

019 a| 897989734;

035 a| (Sirsi) o03473365;

049 a| ERE#;

050 14 a| QC100b| .U5753 no. 767;

074 a| 0249-A;

086 0 a| C 13.46:767;

100 1 a| Kessler, Herbert K.,e| author.=| ^A1480516;

245 10 a| Microelectronic interconnection bonding with ribbon wire /c| H.K. Kessler and A.H. Sher.;

264 1 a| Washington, D.C. :b| U.S. National Bureau of Standards,c| 1973.;

300 a| 1 volume (various paging) :b| illustrations ;c| 26 cm.;

336 a| textb| txt2| rdacontent;

337 a| unmediatedb| n2| rdamedia;

338 a| volumeb| nc2| rdacarrier;

490 1 a| NBS technical note ;v| 767;

500 a| Supported by the Advanced Research Projects Agency of the Dept. of Defense under ARPA order 1889.;

500 a| Electronic Technology Division, Institute for Applied Technology.;

504 a| Includes bibliographical references (pages 23-24).;

505 0 a| Introduction -- Fabrication and testing of wire bonds -- Exploratory studies -- Results -- Bonding equipment -- Conclusions.;

518 a| Issued April 1973.;

520 a| The feasibility of using aluminum ribbon wire for ultrasonic bonding of semiconductor microelectronic interconnections was studied, and several advantages over the use of round wire of equivalent cross-sectional area were found. Ribbon wire bonds exhibited little deformation or heel damage, and a greater percentage of bonds of a certain quality (as judged by pull strength and appearance) could be made over much greater ranges of the bonding machine parameters, time and tool tip displacement, using ribbon wire than was possible with round wire. The ease of positioning ribbon wire was indicated by making multiple ribbon wire bonds side-by-side on a 5-mil square pad, or by stacking up to four bonds one on top of another. However, bonding with harder than normal wire, previously thought to offer certain advantages with respect to higher bond tensile strength, yielded inconsistent results.;

500 a| GPO Historic Shelflist Project- publication not in hand.;

500 a| GPO Cataloging Record Distribution Program (CRDP).;

650 0 a| Miniature electronic equipmentx| Welding.=| ^A604501;

650 0 a| Ultrasonic welding.=| ^A598117;

700 1 a| Sher, A. H.,e| author.?| UNAUTHORIZED;

710 1 a| United States.b| Advanced Research Projects Agency,e| issuing body.=| ^A376730;

830 0 a| NBS technical note ;v| 767.=| ^A4336;

949 a| C 13.46:767w| sudoch| joyner38;

596 a| 1;

998 a| 1009007;

999 a| C 13.46:767w| SUDOCc| 1i| 30372012775117d| 9/13/2005l| JDOSm| JOYNERr| Ys| Yt| JDOSBKu| 9/13/2005x| BOOKz| JFEDDOCSo| .STAFF. 0;

Microelectronic interconnection bonding with ribbon wire / H.K. Kessler and A.H. Sher.

Author/creator	Kessler, Herbert K. author.
Other author	Sher, A. H., author.
Other author	United States. Advanced Research Projects Agency, issuing body.
Format	Book
Publication	Washington, D.C. : U.S. National Bureau of Standards, 1973.
Description	1 volume (various paging) : illustrations ; 26 cm.
Subjects	Miniature electronic equipment--Welding. Ultrasonic welding.

Series	NBS technical note ; 767 NBS technical note ; 767. ^A4336
Contents	Introduction -- Fabrication and testing of wire bonds -- Exploratory studies -- Results -- Bonding equipment -- Conclusions.
Abstract	The feasibility of using aluminum ribbon wire for ultrasonic bonding of semiconductor microelectronic interconnections was studied, and several advantages over the use of round wire of equivalent cross-sectional area were found. Ribbon wire bonds exhibited little deformation or heel damage, and a greater percentage of bonds of a certain quality (as judged by pull strength and appearance) could be made over much greater ranges of the bonding machine parameters, time and tool tip displacement, using ribbon wire than was possible with round wire. The ease of positioning ribbon wire was indicated by making multiple ribbon wire bonds side-by-side on a 5-mil square pad, or by stacking up to four bonds one on top of another. However, bonding with harder than normal wire, previously thought to offer certain advantages with respect to higher bond tensile strength, yielded inconsistent results.
General note	Supported by the Advanced Research Projects Agency of the Dept. of Defense under ARPA order 1889.
General note	Electronic Technology Division, Institute for Applied Technology.
General note	GPO Historic Shelflist Project- publication not in hand.
General note	GPO Cataloging Record Distribution Program (CRDP).
Bibliography note	Includes bibliographical references (pages 23-24).
Date/time/place of a event note	Issued April 1973.
GPO item number	0249-A
Govt. docs number	C 13.46:767

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Joyner	Fed Docs Stacks	C 13.46:767	✔ Available	Place Hold

Microelectronic interconnection bonding with ribbon wire / H.K. Kessler and A.H. Sher.

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