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LEADER 02661cam 2200553 a 4500

001 ocm25006700;

003 OCoLC;

005 20060418102736.0;

007 he bmb024bbca;

008 911220s1990 dcua bbt f000 0 eng c;

037 a| N 90-23772b| NASA;

042 a| pcc;

049 a| ERE$;

074 a| 0830-D (MF);

074 a| 0830-D (online);

086 0 a| NAS 1.15:103192;

088 a| E-5580;

100 1 a| Freed, Alan David.=| ^A420565;

245 10 a| Stress versus temperature dependent activation energies in creep /c| A.D. Freed, S.V. Raj, and K.P. Walker ; prepared for the 3rd International Conference on Constitutive Laws for Engineering Materials, Theory and Applications and Workshop on Innovative Use of Materials in Industrial and Infrastructure Design and Manufacturing sponsored by the University of Arizona, Tucson, Arizona, January 7-12, 1991.;

300 a| 10 p. :b| ill.;

336 a| textb| txt2| rdacontent;

337 a| microformb| h2| rdamedia;

338 a| microficheb| he2| rdacarrier;

490 1 a| NASA technical memorandum ;v| 103192;

500 a| Cover title.;

500 a| Shipping list no.: 91-0093-M.;

530 a| Also available via Internet from the NASA Technical Report Server web site. Address as of 4/18/06: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19900014457%5F1990014457.pdf; current access available via PURL.;

504 a| Includes bibliographical references (p. 9-10).;

500 a| "Performing organization report no.: E-5580"--Technical rept. documentation p.;

500 a| GPO Cataloging Record Distribution Program (CRDP).;

536 h| 505-63-1B;

650 0 a| Copperx| Creep.=| ^A695431;

650 7 a| Activation energy.2| nasat;

650 7 a| Creep properties.2| nasat;

650 7 a| Gibbs free energy.2| nasat;

650 7 a| Stresses.2| nasat;

650 7 a| Temperature dependence.2| nasat;

700 1 a| Raj, Sai V.=| ^A577674;

700 1 a| Walker, K. P.q| (Kevin P.)=| ^A367966;

710 1 a| United States.b| National Aeronautics and Space Administration.=| ^A5437;

830 0 a| NASA technical memorandumv| 103192.=| ^A467613;

856 41 u| https://purl.fdlp.gov/GPO/LPS68891;

949 a| NAS 1.15:103192w| sudoch| joyner32;

596 a| 1;

998 a| 1048458;

999 a| NAS 1.15:103192w| SUDOCc| 1i| MQ1834585d| 8/7/2007l| JDOMIm| JOYNERr| Ys| Yt| JDOFMIu| 8/2/2006x| MICROFORMz| JFEDDOCSo| .STAFF. 0;

Stress versus temperature dependent activation energies in creep / A.D. Freed, S.V. Raj, and K.P. Walker ; prepared for the 3rd International Conference on Constitutive Laws for Engineering Materials, Theory and Applications and Workshop on Innovative Use of Materials in Industrial and Infrastructure Design and Manufacturing sponsored by the University of Arizona, Tucson, Arizona, January 7-12, 1991.

Author/creator	Freed, Alan David
Other author	Raj, Sai V.
Other author	Walker, K. P. (Kevin P.)
Other author	United States. National Aeronautics and Space Administration.
Format	Microform
Publication Info	[Washington, D.C.] : NASA ; [Springfield, Va. : For sale by the National Technical Information Service, 1990?]
Description	10 p. : ill.
Supplemental Content	https://purl.fdlp.gov/GPO/LPS68891
Subjects	Copper--Creep.

Series	NASA technical memorandum ; 103192 NASA technical memorandum 103192. ^A467613
General note	Cover title.
General note	Shipping list no.: 91-0093-M.
General note	"Performing organization report no.: E-5580"--Technical rept. documentation p.
General note	GPO Cataloging Record Distribution Program (CRDP).
Bibliography note	Includes bibliographical references (p. 9-10).
Other forms	Also available via Internet from the NASA Technical Report Server web site. Address as of 4/18/06: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19900014457%5F1990014457.pdf; current access available via PURL.
Reproduction note	Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration, 1990] 1 microfiche : negative.
Funding information	505-63-1B
Technical rpt number	E-5580
GPO item number	0830-D (MF)
GPO item number	0830-D (online)
Govt. docs number	NAS 1.15:103192
Stock number	N 90-23772 NASA

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