Advanced MEMS packaging / John H. Lau [and others].

Other author Lau, John H.
Format Book
Publication InfoNew York : McGraw-Hill, ©2010.
Descriptionxxiii, 552 pages : illustrations ; 24 cm
Subjects
Microelectromechanical systems.
Microelectronic packaging.

Variant title Advanced microelectromechanical systems packaging
Contents Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
Bibliography noteIncludes bibliographical references and index.
LCCN 2009040456
ISBN9780071626231 (alk. paper)
ISBN0071626239 (alk. paper)