Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies : IMAPS 2nd Advanced Technoilogy Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, April 27, 2010 / Kevin Bennion, Gilbert Moreno.

Author/creator Bennion, Kevin
Other author Moreno, Gilbert.
Other author National Renewable Energy Laboratory (U.S.)
Format Electronic
Publication InfoGolden, Colo. : National Renewable Energy Laboratory, [2009]
Description1 online resource (26 p.) : col. ill.
Supplemental Contenthttps://purl.fdlp.gov/GPO/LPS124496
Subjects

SeriesNREL/PR ; 540-48147
NREL/PR 540-48147. ^A782094
General noteTitle from PDF title screen (viewed on July 26, 2010).
General noteGPO Cataloging Record Distribution Program (CRDP).
GPO item number0430-P-09 (online)
Govt. docs number E 9.22:NREL/PR-540-48147