Induction curing of a phase-toughened adhesive / by Christian J. Yungwirth, Eric D. Wetzel, and James M. Sands.

Author/creator Yungwirth, Christian J.
Other author Wetzel, Eric D.
Other author Sands, James M.
Other author U.S. Army Research Laboratory.
Format Electronic
Publication InfoAberdeen Proving Ground, Md. : Army Research Laboratory, [2003]
Description1 online resource (1 volume (various pagings)) : digital, PDF file.
Supplemental Contenthttp://purl.fdlp.gov/GPO/gpo1392
Subjects

SeriesARL-TR ; 2999
ARL-TR (Aberdeen Proving Ground, Md.) ; 2999. ^A566074
Abstract Phase-toughened epoxy/dicyandiamide adhesives were loaded with magnetic particle filler and then cured by induction processing. The effect of induction field magnitude and exposure time on bonding strength of the loaded adhesives was characterized. At low magnetic field amplitudes, bond strength increased significantly with exposure time, with the highest strength bonds occurring after 60-min exposures. At high magnetic field amplitudes, bond strength increased only slightly with exposure time, so that significant bond strength was reached after 15 min of exposure. In general, the induction-cured adhesives exhibited lower bond strengths than comparable oven-cured adhesives. All of these strength trends were likely due to process- induced variations in the adhesive degree of cure, toughening phase development, or thermal degradation.
General noteTitle from title screen (viewed Nov. 26, 2010).
General note"June 2003."
Bibliography noteIncludes bibliographical references (p. 20-21).
Access restrictionAPPROVED FOR PUBLIC RELEASE.
Issued in other formPaper version: Yungswirth, Christian J. Induction curing of a phase-toughened adhesive. 1 v. (various pagings).
Technical rpt#ARL-TR-2999
GPO item number0324-A-01 (online)
Govt. docs number D 101.133:2999

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