Thermomechanical couplings in solids : Jean Mandel memorial symposium, Paris France, 1-5 September, 1986 / edited by H.D. Bui and Q.S. Nguyen.

Format Book
Publication InfoAmsterdam ; New York : North-Holland ; New York, N.Y., U.S.A. : Sole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co., 1987.
Descriptionxiii, 425 pages : illustrations ; 24 cm
Subjects
Thermal stresses--Congresses.
Thermoelasticity--Congresses.
Coupled problems (Complex systems)--Congresses.
Materials--Testing. --Congresses.

Other author/creatorMandel, Jean.
Other author/creatorBui, Huy Duong.
Other author/creatorNguyen, Q. S.
Other author/creatorInternational Union of Theoretical and Applied Mechanics.
Other author/creatorI.U.T.A.M. Symposium on "Thermomechanical Couplings in Solids" (1986 : Paris, France)
General noteLectures presented at the I.U.T.A.M. Symposium on "Thermomechanical Couplings in Solids," held in Paris, Sept. 1986.
Bibliography noteIncludes bibliographies.
LCCN 87008982
ISBN0444702369 (U.S.)