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001 ocn798255545;

003 OCoLC;

005 20120705100622.0;

006 m d f ;

007 cr b||||||||||;

008 120705s2010 dcu ob f000 0 eng c;

040 a| GPOc| GPOd| MvI;

042 a| pcc;

043 a| n-us---;

049 a| ERE#;

074 a| 0980-E (online);

086 0 a| ITC 1.12:337-TA-630;

110 2 a| United States International Trade Commission.=| ^A253688;

245 10 a| In the matter of certain semiconductor chips with minimized chip package size and products containing same (III) :b| investigation no. 337-TA-630.;

246 30 a| Certain semiconductor chips with minimized chip package size and products containing same (III);

260 a| Washington, DC :b| U.S. International Trade Commission,c| [2010];

300 a| 1 online resource ([249] p.);

336 a| textb| txt2| rdacontent;

337 a| computerb| c2| rdamedia;

338 a| online resourceb| cr2| rdacarrier;

490 1 a| Publication ;v| 4209;

500 a| Title from title screen (viewed on July 2, 2012).;

500 a| "December 2010.";

500 a| GPO Cataloging Record Distribution Program (CRDP).;

504 a| Includes bibliographical references.;

650 0 a| Semiconductor industryz| United States.=| ^A162705;

650 0 a| Patent infringement.=| ^A457672;

651 0 a| United Statesx| Commercial policy.=| ^A16264;

776 08 i| Print version:a| United States International Trade Commission.t| In the matter of certain semiconductor chips with minimized chip package size and products containing same (III)w| (OCoLC)697298413;

830 0 a| USITC publication ;v| 4209.=| ^A385265;

856 40 u| https://purl.fdlp.gov/GPO/gpo24856;

949 a| Click on web addressw| asish| joyner94;

596 a| 1;

998 a| 3089923;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 3089923-1001l| JNETm| JOYNERr| Ys| Yt| JNE1DOu| 8/7/2012x| EDOCUMENTz| JERESOURCE;

In the matter of certain semiconductor chips with minimized chip package size and products containing same (III) : investigation no. 337-TA-630.

Author/creator	United States International Trade Commission
Format	Electronic
Publication Info	Washington, DC : U.S. International Trade Commission, [2010]
Description	1 online resource ([249] p.)
Supplemental Content	https://purl.fdlp.gov/GPO/gpo24856
Subjects	Semiconductor industry--United States. Patent infringement. United States--Commercial policy.

Portion of title	Certain semiconductor chips with minimized chip package size and products containing same (III)
Series	Publication ; 4209 USITC publication ; 4209. ^A385265
General note	Title from title screen (viewed on July 2, 2012).
General note	"December 2010."
General note	GPO Cataloging Record Distribution Program (CRDP).
Bibliography note	Includes bibliographical references.
Issued in other form	Print version: United States International Trade Commission. In the matter of certain semiconductor chips with minimized chip package size and products containing same (III)
GPO item number	0980-E (online)
Govt. docs number	ITC 1.12:337-TA-630

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In the matter of certain semiconductor chips with minimized chip package size and products containing same (III) : investigation no. 337-TA-630.

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