Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches / Ryan Knight and Evan Cheng.

Author/creator Knight, Ryan author.
Other author Cheng, Evan, author.
Other author U.S. Army Research Laboratory, issuing body.
Format Electronic
PublicationAdelphi, MD : Army Research Laboratory, September 2014.
Description1 online resource (v, 29 pages) : color illustrations.
Supplemental Contenthttps://purl.fdlp.gov/GPO/gpo61207
Subjects

SeriesARL-TR ; 7094
ARL-TR (Aberdeen Proving Ground, Md.) ; 7094. ^A566074
General noteTitle from title screen (viewed Sept. 29, 2015).
General note"September 2014."
Bibliography noteIncludes bibliographical references (page 26).
Report noteFinal.
Funding informationARL-TR-7094
GPO item number0324-A-01 (online)
Govt. docs number D 101.133:7094