Proceedings / 3rd International Symposium on Advanced Packaging Materials--processes, properties, and interfaces, Chateau Elan, Braselton, Georgia, March 9-12, 1997 ; co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology Society, Georgia Institute of Technology, Packaging Research Center (PRC) ; participating societies: American Society of Materials ... [et al.].

Author/creator International Symposium on Advanced Packaging Materials
Format Electronic
Publication Info[New York] : Institute of Electrical and Electronics Engineers,
Descriptionviii, 183 p. : ill. ; 28 cm.
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Supplemental ContentFull text available from IEEE Conference Proceedings Archive
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Subjects
Electronic packaging--Materials. --Congresses.

Other author/creatorInternational Microelectronics and Packaging Society.
Other author/creatorComponents, Packaging & Manufacturing Technology Society.
Other author/creatorGeorgia Institute of Technology. Packaging Research Center.
Other author/creatorASM International.
Other author/creatorIEEE Xplore (Online service)
Bibliography noteIncludes bibliographical references and index.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 97070176
ISBN0780338189 (softbound)