/LC.GIF&client=easterncarolinaedu)
Proceedings / 1998 International Conference on Multichip Modules and High Density Packaging, April 15-17, 1998, The Adam's Mark Hotel, Denver, Colorado ; sponsored by IMAPS ... [et al.].
| Author/creator | International Conference on Multichip Modules and High Density Packaging |
| Other author | International Microelectronics and Packaging Society. |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | [New York] : Institute of Electrical and Electronics Engineers, |
| Description | xi, 547 p. : ill. ; 28 cm. |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Supplemental Content | Full text available from IEEE Conference Proceedings Archive |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Subjects |
| Variant title | Multichip modules and high density packaging |
| General note | "IEEE catalog number: 98EX154"--T.p. verso. |
| Bibliography note | Includes bibliographical references and index. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 98084630 |
| ISBN | 0780348508 (softbound) |
| ISBN | 0780348516 (microfiche) |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | ✔ Available |