/LC.GIF&client=easterncarolinaedu)
Advanced MEMS packaging / John H. Lau ... [et al.].
| Other author | Lau, John H. |
| Format | Electronic |
| Publication Info | New York : McGraw-Hill, |
| Description | xxiii, 552 p. : ill. ; 24 cm. |
| Supplemental Content | Full text available from Digital Engineering Library |
| Supplemental Content | Full text available from AccessEngineering |
| Subjects |
| Variant title | Advanced microelectromechanical systems packaging |
| Contents | Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices. |
| Bibliography note | Includes bibliographical references and index. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2009040456 |
| ISBN | 9780071626231 (alk. paper) |
| ISBN | 0071626239 (alk. paper) |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | ✔ Available |