Area Array Packaging Handbook Manufacturing and Assembly
| Author/creator | Gilleo, Kenneth B. Author |
| Format | Electronic |
| Publication Info | New York : McGraw-Hill Professional Publishing Blacklick : McGraw-Hill Companies, The [Distributor] |
| Description | 1000 p. ill 09.300 x 07.600 in. |
| Supplemental Content | Full text available from AccessEngineering |
| Supplemental Content | Full text available from Digital Engineering Library |
| Subjects |
| Summary | Annotation *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI) |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2001041051 |
| ISBN | 9780071374934 |
| ISBN | 0071374930 (Trade Cloth) Out of Print |
| Standard identifier# | 9780071374934 |
| Stock number | 0071374930 00721673 |