Fundamentals of microsystems packaging / Rao R. Tummala, editor.

Other author Tummala, Rao R., 1942-
Format Electronic
Publication InfoNew York : McGraw-Hill,
Descriptionvii, 967 p. : col. ill. ; 25 cm.
Supplemental ContentFull text available from Digital Engineering Library
Supplemental ContentFull text available from AccessEngineering
Subjects
Electronic packaging--Handbooks, manuals, etc.
Microelectronic packaging--Handbooks, manuals, etc.
Miniature electronic equipment--Packaging. --Handbooks, manuals, etc.

Bibliography noteIncludes bibliographical references and index.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 2001273178
ISBN0071371699