Microvias For Low Cost, High Density Interconnects
| Author/creator | Lau, John H. Author |
| Other author | Lee, Ricky S. W. Author |
| Format | Electronic |
| Publication Info | New York : McGraw-Hill Professional Publishing Blacklick : McGraw-Hill Companies, The [Distributor] |
| Description | xxiii, 565 p. ill 09.100 x 06.300 in. |
| Supplemental Content | Full text available from AccessEngineering |
| Supplemental Content | Full text available from eBooks on EBSCOhost |
| Supplemental Content | Full text available from Digital Engineering Library |
| Subjects |
| Series | Electronic Packaging and Interconnection Ser. |
| Summary | Annotation |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2001030752 |
| ISBN | 9780071363273 |
| ISBN | 0071363270 (Trade Cloth) Active Record |
| Standard identifier# | 9780071363273 |
| Stock number | 00721673 |