Proceedings 1993 IEEE 11th International Conference on Conduction and Breakdown in Dielectric Liquids (ICDL), Baden-Dättwil, Switzerland, July 19-23, 1993 / edited by J. Fuhr and P. Biller ; sponsored by IEEE Dielectrics and Electrical Insulation Society (DEIS), ABB Corporate Research Center Switzerland, Power Engineering Society (ETG) of the Swiss Electrotechnical Association (SEV).

Author/creator International Conference on Conduction and Breakdown in Dielectric Liquids
Format Electronic
Publication Info[New York] : Institute of Electrical and Electronic Engineers,
Descriptionii, 594 p. : ill. ; 21 cm.
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Supplemental ContentFull text available from IEEE Conference Proceedings Archive
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Subjects

Other author/creatorFuhr, J. R.
Other author/creatorBiller, P.
Other author/creatorIEEE Dielectrics and Electrical Insulation Society.
Other author/creatorIEEE Xplore (Online service)
General noteCover title.
General note"93CH3204-5."
Bibliography noteIncludes bibliographical references.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 92056491
ISBN0780307917