Stress induced phenomena in metallization fourth international workshop, Tokyo, Japan, June, 1997 / editors, Hidekazu Okabayashi, Shoso Shingubara, Paul S. Ho.

Format Electronic
Publication InfoWoodbury, N.Y. : American Institute of Physics,
Descriptionix, 519 p. : ill. ; 25 cm.
Supplemental ContentFull text available from AIP Conference Proceedings
Subjects
Integrated circuits--Defects. --Congresses.
Thin film devices--Defects. --Congresses.
Electrodiffusion--Congresses.
Metallic films--Congresses.
Electrochemical metallizing--Congresses.
Aluminum films--Congresses.
Semiconductors--Defects. --Congresses.
Liquid crystal devices--Defects. --Congresses.
Acoustic surface wave devices--Defects. --Congresses.

Other author/creatorOkabayashi, Hidekazu.
Other author/creatorShingubara, Shoso.
Other author/creatorHo, P. S.
Other author/creatorInternational Workshop on Stress-Induced Phenomena in Metallization 1997 : Tokyo, Japan) (4th :
SeriesAIP conference proceedings ; 418
AIP conference proceedings ; no. 418. ^A24766
General note"DOE CONF-976190"--T.p. verso.
Bibliography noteIncludes bibliographical references and index.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 97077868
ISBN1563966824
Technical rpt numberDOE CONF-976190

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