1998 IEEE 14th Annual Semiconductor Thermal Measurement and Management Symposium
| Author/creator | IEEE, Components, Packaging and Manufacturing Technology Society Staff |
| Other author | IEEE, Institute of Electrical and Electronics Engineers, Inc. Staff. |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | Piscataway : IEEE |
| Description | 200 p. 28.000 x 022.000 cm. |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Supplemental Content | Full text available from IEEE Conference Proceedings Archive |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Subjects |
| Summary | Annotation These papers are the forum for presenting new developments in and applications relating to generation and removal of heat within semiconductor devices and the measurement of junction temperatures under various applications and environmental conditions. Thermal characterization of electronic parts, the modeling and analysis, and measurement of components is critical to the advancement of reliability of component performance. Recognition is made of the fact that component thermal tests and performances under isolated conditions are not matched by on the board thermal performances where the variables of heat flow are effected by packaging design. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| ISBN | 9780780344860 |
| ISBN | 0780344863 (Trade Paper) Active Record |
| Standard identifier# | 9780780344860 |
| Stock number | 98CH36195 00013077 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | ✔ Available |