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LEADER 02724cam 22005057a 4500

001 ssj0000394409;

003 WaSeSS;

005 20210312081412.0;

006 m d ;

007 cr n ;

008 001020s2000 njua sb 100 0 eng d;

010 a| 00110269;

020 a| 0780366549;

035 a| (WaSeSS)ssj0000394409;

040 a| LHLc| LHLd| DLCd| WaSeSS;

042 a| lccopycat;

049 a| EREEa| NEHH;

050 00 a| TK7870.15b| .E57 2000;

082 00 a| 621.381/0462| 21;

111 2 a| EMAP2000d| (2000 :c| Hong Kong, China)?| UNAUTHORIZED;

245 10 a| International Symposium on Electronic Materials and Packaging (EMAP2000)h| [electronic resource] :b| November 30-December 2, 2000, Hong Kong /c| organized by Hong Kong University of Science and Technology, Department of Mechanical Engineering & EPACK LAB ; in collaboration with Institute of Electrical and Electronics Engineres, IEEE Component, Packaging & Manufacturing Technology, Hong Kong Chapter.;

246 31 a| EMAP2000;

246 31 a| Electronic materials and packaging;

260 a| Piscataway, New Jersey :b| IEEE,;

300 a| xii, 478 p. :b| ill. ;c| 30 cm.;

504 a| Includes bibliographic references.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Electronic packagingv| Congresses.=| ^A724961;

655 0 a| Electronic books.=| ^A491897;

710 2 a| Hong Kong University of Science and Technology.b| Department of Mechanical Engineering.=| ^A1254366;

710 2 a| EPACK LAB.?| UNAUTHORIZED;

710 2 a| Institute of Electrical and Electronics Engineers.=| ^A9546;

710 2 a| Components, Packaging & Manufacturing Technology Society.b| Hong Kong Chapter.?| UNAUTHORIZED;

710 2 a| IEEE Xplore (Online service)=| ^A534875;

856 40 z| Full text available from IEEE Electronic Library (IEL)u| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fieeexplore.ieee.org%2Fservlet%2Fopac%3Fpunumber%3D7253;

856 40 z| Full text available from IEEE Electronic Library (IEL) Conference Proceedingsu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fieeexplore.ieee.org%2Fservlet%2Fopac%3Fpunumber%3D7253;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL77;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC60;

596 a| 1 3 4;

998 a| 4672994;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4672994-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 3/21/2017x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4672994-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 3/21/2017x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4672994-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 3/21/2017x| EBOOKz| JERESOURCE;

International Symposium on Electronic Materials and Packaging (EMAP2000) November 30-December 2, 2000, Hong Kong / organized by Hong Kong University of Science and Technology, Department of Mechanical Engineering & EPACK LAB ; in collaboration with Institute of Electrical and Electronics Engineres, IEEE Component, Packaging & Manufacturing Technology, Hong Kong Chapter.

Author/creator	EMAP2000
Format	Electronic
Publication Info	Piscataway, New Jersey : IEEE,
Description	xii, 478 p. : ill. ; 30 cm.
Supplemental Content	Full text available from IEEE Electronic Library (IEL)
Supplemental Content	Full text available from IEEE Electronic Library (IEL) Conference Proceedings
Subjects	Electronic packaging--Congresses.

Other author/creator	Hong Kong University of Science and Technology. Department of Mechanical Engineering.
Other author/creator	EPACK LAB.
Other author/creator	Institute of Electrical and Electronics Engineers.
Other author/creator	Components, Packaging & Manufacturing Technology Society. Hong Kong Chapter.
Other author/creator	IEEE Xplore (Online service)
Parallel title	EMAP2000
Parallel title	Electronic materials and packaging
Bibliography note	Includes bibliographic references.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	00110269
ISBN	0780366549

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