Multi-Chip Module Conference, 1996 IEEE (MCMC-96)
| Author/creator | Institute of Electrical and Electronics Engineers, Inc. Staff |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | Los Alamitos : IEEE Computer Society Press |
| Description | 224 p. |
| Supplemental Content | Full text available from IEEE Conference Proceedings Archive |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Subjects |
| Summary | Annotation Considers multi-chip modules from perspectives of packaging, technology and design, circuits and systems design, computer- aided design, modeling, analysis, and education. The 37 papers focus on such specific topics as wireless communications, large- area pixel detectors, fluxless flip-chips, memory hierarchy organizations, chip and package co-design techniques for clock networks, and polymer optical couplers. No subject index. Annotation copyright by Book News, Inc., Portland, OR |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 95035893 |
| ISBN | 9780818672866 |
| ISBN | 0818672862 (Trade Paper) Active Record |
| Standard identifier# | 9780818672866 |
| Stock number | PRO7225 00029433 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | ✔ Available |