2014 International Conference on Electronics Packaging (ICEP)
| Author/creator | IEEE Staff |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | Piscataway : IEEE |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Subjects |
| Summary | Annotation ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling simulation, and applications |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| ISBN | 9781479933679 |
| ISBN | 1479933678 (Spiral) Active Record |
| Stock number | 00066573 |