2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC MAM)
| Author/creator | IEEE Staff |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | Piscataway : IEEE |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Subjects |
| Summary | Annotation The 18th annual IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology devoted to leading edge research in the field of advanced metallization and 3D integration for ULSI IC applications MAM 2015 will be the 24th in a conference series devoted to research on materials properties and interactions of interconnect and silicide materials |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| ISBN | 9781467373579 |
| ISBN | 1467373575 (Spiral) Active Record |
| Stock number | 00066573 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | ✔ Available |