IEEE Multi-Chip Module Conference, 1993
| Author/creator | Institute of Electrical and Electronics Engineers, Inc. Staff |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | Piscataway : IEEE |
| Description | 224 p. |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Supplemental Content | Full text available from IEEE Conference Proceedings Archive |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Subjects |
| Summary | Annotation Papers delivered at the Santa Cruz, Calif. meeting held 15-18 March, 1993 (under multiple sponsorship) on high speed systems, infrastructure, new technology, test and reliability, interconnect modelling and analysis, and design of multichip modules. As usual the Computer Society Press has published without an index (though quickly--which is a great virtue). Annotation copyright by Book News, Inc., Portland, OR |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 92075230 |
| ISBN | 9780818635403 |
| ISBN | 0818635401 (Trade Paper) Out of Print |
| Standard identifier# | 9780818635403 |
| Stock number | 00013077 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | ✔ Available |