Tools

LEADER 02648cam 22005055a 4500

001 ssj0000393491;

003 WaSeSS;

005 20210312081412.0;

006 m d ;

007 cr n ;

008 001211s2000 vaua sb 101 0 eng d;

010 a| 00712517;

020 a| 0930815599 (softbound);

035 a| (WaSeSS)ssj0000393491;

040 a| RRRc| RRRd| DLCd| WaSeSS;

042 a| lccopycat;

049 a| EREEa| NEHH;

050 00 a| TK7870.15b| .I586 2000;

082 00 a| 621.381/0462| 21;

111 2 a| International Symposium on Advanced Packaging Materialsd| (2000 :c| Braselton, Georgia)?| UNAUTHORIZED;

245 10 a| International Symposium on Advanced Packaging Materialsh| [electronic resource] :b| processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 6-8, 2000 /c| co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.].;

246 31 a| Advanced packaging materials;

246 30 a| Proceedings;

260 a| Reston, Virginia :b| IMAPS ;a| Piscataway, New Jersey :b| IEEE,;

300 a| ix, 349 p. :b| ill. ;c| 28 cm.;

500 a| "... IEEE Catalog Number 00TH8507"--verso of t.p.;

504 a| Includes bibliographic references and index.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Electronic packagingx| Materialsv| Congresses.=| ^A241674;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Wong, C. P.,d| 1947-?| UNAUTHORIZED;

710 2 a| International Microelectronics and Packaging Society.?| UNAUTHORIZED;

710 2 a| IEEE Xplore (Online service)=| ^A534875;

856 40 z| Full text available from IEEE Electronic Library (IEL)u| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fieeexplore.ieee.org%2Fservlet%2Fopac%3Fpunumber%3D6984;

856 40 z| Full text available from IEEE Electronic Library (IEL) Conference Proceedingsu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fieeexplore.ieee.org%2Fservlet%2Fopac%3Fpunumber%3D6984;

947 a| (OCoLC)ocm45062652;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL77;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC60;

596 a| 1 3 4;

998 a| 4689563;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4689563-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 4/14/2017x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4689563-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 4/14/2017x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4689563-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 4/14/2017x| EBOOKz| JERESOURCE;

International Symposium on Advanced Packaging Materials processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 6-8, 2000 / co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.].

Author/creator	International Symposium on Advanced Packaging Materials
Other author	Wong, C. P., 1947-
Other author	International Microelectronics and Packaging Society.
Other author	IEEE Xplore (Online service)
Format	Electronic
Publication Info	Reston, Virginia : IMAPS ; Piscataway, New Jersey : IEEE,
Description	ix, 349 p. : ill. ; 28 cm.
Supplemental Content	Full text available from IEEE Electronic Library (IEL)
Supplemental Content	Full text available from IEEE Electronic Library (IEL) Conference Proceedings
Subjects	Electronic packaging--Materials. --Congresses.

Parallel title	Advanced packaging materials
Portion of title	Proceedings
General note	"... IEEE Catalog Number 00TH8507"--verso of t.p.
Bibliography note	Includes bibliographic references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	00712517
ISBN	0930815599 (softbound)

Availability

Library	Location	Call Number	Status	Item Actions
	Electronic Resources	Online Content Full text available from IEEE Electronic Library (IEL) Full text available from IEEE Electronic Library (IEL)	✔ Available

International Symposium on Advanced Packaging Materials processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 6-8, 2000 / co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.].

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