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010 a| 2004296963;

020 a| 0930815394 (pbk.);

035 a| (WaSeSS)ssj0000451086;

042 a| lccopycat;

049 a| EREEa| NEHH;

050 00 a| TK7870.15b| .M82 1994;

082 00 a| 621.381/0462| 22;

245 00 a| Multichip modulesh| [electronic resource] :b| international conference and exhibition, 13-15 April 1994, Denver, Colorado /c| sponsored by ISHM--the Microelectronics Society ... [et al.] ; in cooperation with SEMI--Semiconductor Equipment and Materials International, IPC--the Institute for Interconnecting and Packaging Electronic Circuits.;

300 a| x, 630 p. :b| ill. ;c| 28 cm.;

490 1 a| SPIE proceedings series ;v| v. 2256;

500 a| "Third International Conference and Exhibition on Multichip Modules"--P. iii.;

500 a| Spine title: 1994 proceedings International Conference and Exhibition on Multichip Modules.;

504 a| Includes bibliographical references and index.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Multichip modules (Microelectronics)v| Congresses.=| ^A906440;

650 0 a| Electronic packagingv| Congresses.=| ^A724961;

650 0 a| Microelectronic packagingv| Congresses.=| ^A728200;

655 0 a| Electronic books.=| ^A491897;

710 2 a| International Society for Hybrid Microelectronics.=| ^A728532;

710 2 a| Semiconductor Equipment and Materials International.=| ^A689419;

710 2 a| International Electronics Packing Society.?| UNAUTHORIZED;

710 2 a| Institute for Interconnecting and Packaging Electronic Circuits (Evanston, Ill.)?| UNAUTHORIZED;

710 2 a| Society of Photo-optical Instrumentation Engineers.=| ^A89712;

710 2 a| IEEE Xplore (Online service)=| ^A534875;

711 2 a| International Conference and Exhibition on Multichip Modulesn| (3rd :d| 1994 :c| Denver, Colo.)?| UNAUTHORIZED;

740 0 a| 1994 proceedings International Conference and Exhibition on Multichip Modules.;

830 0 a| Proceedings of SPIE--the International Society for Optical Engineering ;v| v. 2256.=| ^A281550;

856 40 z| Full text available from IEEE Electronic Library (IEL) Conference Proceedingsu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fieeexplore.ieee.org%2Fservlet%2Fopac%3Fpunumber%3D6078;

856 40 z| Full text available from IEEE Conference Proceedings Archiveu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fieeexplore.ieee.org%2Fservlet%2Fopac%3Fpunumber%3D6078;

856 40 z| Full text available from IEEE Electronic Library (IEL)u| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fieeexplore.ieee.org%2Fservlet%2Fopac%3Fpunumber%3D6078;

947 a| (OCoLC)ocm31859876;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL77;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC60;

596 a| 1 3 4;

998 a| 4690014;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4690014-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 4/14/2017x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4690014-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 4/14/2017x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4690014-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 4/14/2017x| EBOOKz| JERESOURCE;

Multichip modules international conference and exhibition, 13-15 April 1994, Denver, Colorado / sponsored by ISHM--the Microelectronics Society ... [et al.] ; in cooperation with SEMI--Semiconductor Equipment and Materials International, IPC--the Institute for Interconnecting and Packaging Electronic Circuits.

Format	Electronic
Publication Info	Reston, Va. : ISHM ; Wheaton, Ill. : International Electronics Packaging Society ; [Belingham, Wash.] : Published in cooperation with SPIE--the International Society for Optical Engineering,
Description	x, 630 p. : ill. ; 28 cm.
Supplemental Content	Full text available from IEEE Electronic Library (IEL) Conference Proceedings
Supplemental Content	Full text available from IEEE Conference Proceedings Archive
Supplemental Content	Full text available from IEEE Electronic Library (IEL)
Subjects	Multichip modules (Microelectronics)--Congresses. Electronic packaging--Congresses. Microelectronic packaging--Congresses.

Other author/creator	International Society for Hybrid Microelectronics.
Other author/creator	Semiconductor Equipment and Materials International.
Other author/creator	International Electronics Packing Society.
Other author/creator	Institute for Interconnecting and Packaging Electronic Circuits (Evanston, Ill.)
Other author/creator	Society of Photo-optical Instrumentation Engineers.
Other author/creator	IEEE Xplore (Online service)
Other author/creator	International Conference and Exhibition on Multichip Modules 1994 : Denver, Colo.) (3rd :
Series	SPIE proceedings series ; v. 2256 Proceedings of SPIE--the International Society for Optical Engineering ; v. 2256. ^A281550
General note	"Third International Conference and Exhibition on Multichip Modules"--P. iii.
General note	Spine title: 1994 proceedings International Conference and Exhibition on Multichip Modules.
Bibliography note	Includes bibliographical references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
Other title	1994 proceedings International Conference and Exhibition on Multichip Modules.
LCCN	2004296963
ISBN	0930815394 (pbk.)

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