Attachment of free filament thermocouples for temperature measurements on CMC / Jih-Fen Lei and Michael D. Cuy, Stephen P. Wnuk.

Author/creator Lei, Jih-Fen author.
Other author Cuy, Michael D., author.
Other author Wnuk, Stephen P., author.
Other author Lewis Research Center, issuing body.
Format Electronic
PublicationCleveland, Ohio : National Aeronautics and Space Administration, Lewis Research Center, June 1997.
Description1 online resource (7 pages) : illustrations.
Supplemental Contenthttps://purl.fdlp.gov/GPO/gpo79350

Variant title Attachment of free filament thermocouples for temperature measurements on ceramic matrix composites
SeriesNASA technical memorandum ; 107488
NASA technical memorandum 107488. ^A467613
General note"June 1997."
General note"Performing organization: National Aeronautics and Space Administration, Lewis Research Center"--Report documentation page.
General noteGPO Cataloging Record Distribution Program (CRDP).
Bibliography noteIncludes bibliographical reference (page 7).
Report noteTechnical memorandum.
Funding informationSponsored by the National Aeronautics and Space Administration WU-537-04-22 E-10785
Source of descriptionDescription based on online resource; title from PDF title page (NASA, viewed June 13, 2017).
Issued in other formPrint version: Lei, Jih-Fen. Attachment of free filament thermocouples for temperature measurements on CMC
Issued in other formMicrofiche version: Lei, Jih-Fen. Attachment of free filament thermocouples for temperature measurements on CMC
GPO item number0830-D (online)
Govt. docs number NAS 1.15:107488