2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)

Author/creator IEEE Staff
Other author IEEE Xplore (Online service)
Format Electronic
Publication InfoPiscataway : IEEE
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Subjects

Summary Annotation The Primary objective of the Conference is to provide an international forum for dissemination of information and scientific results relating to education, research and development activities It is a tradition for all participants of the seminar to present paper(s) which are published in the proceedings SIITME is a premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries on topics related to their experimental and theoretical work in the very wide field of electronics and microelectronics technology and packaging Based on a unique combination of oral and poster presentations as well as individual meetings, researchers can come together to discuss scientific problems and organize international cooperation in a convenient atmosphere during three conference days
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
ISBN9781509003334
ISBN1509003339 (Spiral) Active Record
Stock number00066573

Availability

Library Location Call Number Status Item Actions
Electronic Resources ✔ Available