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010 a| 2012007343;

020 a| 9781107003781 (hardback);

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245 00 a| LCP for microwave packages and modulesh| [electronic resource] /c| [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.;

260 a| Cambridge ;a| New York :b| Cambridge University Press,;

300 a| xiv, 253 p. ;c| 26 cm.;

490 0 a| The Cambridge RF and microwave engineering series;

504 a| Includes bibliographical references and index.;

505 8 a| Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability.;

506 a| Available only to authorized users.;

520 a| "A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering"--c| Source other than Library of Congress .;

538 a| Mode of access: World Wide Web;

650 0 a| Microwave devicesx| Materials.=| ^A84979;

650 0 a| Flexible electronics.=| ^A1407739;

650 0 a| Microelectronic packagingx| Materials.=| ^A269388;

650 0 a| Liquid crystal devices.=| ^A72760;

650 0 a| Polymer liquid crystals.=| ^A214277;

650 7 a| TECHNOLOGY & ENGINEERING / Microwaves.2| bisacsh;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Pham, Anh-Vu H.=| ^A1151235;

700 1 a| Chen, Morgan J.=| ^A1151236;

700 1 a| Aihara, Kunia.=| ^A1151237;

856 40 z| Full text available from Ebook Central - Academic Completeu| https://ebookcentral.proquest.com/lib/eastcarolina/detail.action?docID=907131;

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999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4974518-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 12/5/2018x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4974518-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 12/5/2018x| EBOOKz| JERESOURCE;

LCP for microwave packages and modules / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.

Other author	Pham, Anh-Vu H.
Other author	Chen, Morgan J.
Other author	Aihara, Kunia.
Format	Electronic
Publication Info	Cambridge ; New York : Cambridge University Press,
Description	xiv, 253 p. ; 26 cm.
Supplemental Content	Full text available from Ebook Central - Academic Complete
Subjects	Microwave devices--Materials. Flexible electronics. Microelectronic packaging--Materials. Liquid crystal devices. Polymer liquid crystals.

Series	The Cambridge RF and microwave engineering series
Contents	Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability.
Abstract	"A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering"-- Source other than Library of Congress .
Bibliography note	Includes bibliographical references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	2012007343
ISBN	9781107003781 (hardback)

LCP for microwave packages and modules / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.

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