2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

Author/creator IEEE Staff
Other author IEEE Xplore (Online service)
Format Electronic
Publication InfoPiscataway : IEEE
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Subjects

Summary Annotation The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia Pacific region to share the recent progress of modeling, simulation and measurement for the electrical design issues on chip, package and system levels
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
ISBN9781467381000
ISBN1467381004 (Spiral) Active Record
Stock number00066573