Through-silicon Vias for 3d Integration / John H. Lau.
| Author/creator | Lau, John H. |
| Format | Electronic |
| Publication Info | New York : McGraw-Hill, [2013] |
| Description | xxiv, 487 pages : illustrations (some color) ; 24 cm |
| Supplemental Content | Full text available from AccessEngineering |
| Subjects |
| Summary | This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products. |
| Bibliography note | Includes bibliographical references and index. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2015510566 |
| ISBN | 9780071785143 |
| ISBN | 0071785140 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |