Tools

LEADER 05767cam 22005177i 4500

001 ssj0001766848;

003 WaSeSS;

005 20210713080458.0;

006 m d ;

007 cr n ;

008 170601s2016 ne a sb 001 0 eng d;

010 a| 2017304826;

020 a| 9780081000403 (hbk.);

020 a| 0081000405 (hbk.);

020 z| 9780081000571 (online);

035 a| (WaSeSS)ssj0001766848;

042 a| lccopycat;

049 a| EREEa| NEHH;

050 00 a| TA417.2b| .M2195 2016;

082 04 a| 620.1/1272| 23;

245 00 a| Materials characterization using nondestructive evaluation (NDE) methodsh| [electronic resource] /c| edited by Gerhard Hübschen [and 3 others].;

260 a| Amsterdam ;a| Boston :b| Elsevier/Woodhead Publishing,c| [2016];

300 a| xv, 303 pages :b| illustrations (some color)c| 24 cm.;

490 1 a| Woodhead Publishing series in electronic and optical materials ;v| number 88;

504 a| Includes bibliographical references and index.;

505 00 a| Machine generated contents note:g| 1.t| Atomic force microscopy (AFM) for materials characterization --g| 1.1.t| Introduction --g| 1.2.t| Comparison of AFM with other microscopy techniques --g| 1.3.t| Principles of AFM technique --g| 1.4.t| Construction and basic components of AFM --g| 1.5.t| Working modes of AFM --g| 1.6.t| Application of AFM for material characterization --g| 1.7.t| Conclusions --t| Acknowledgments --t| References --g| 2.t| Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) for materials characterization --g| 2.1.t| Introduction --g| 2.2.t| Why electron microscopy? --g| 2.3.t| Types of microscopes --g| 2.4.t| Interaction of electrons with materials --g| 2.5.t| What material features can we analyze using electron microscopy? --g| 2.6.t| Scanning electron microscopy --g| 2.7.t| Key microstructural features analyzed by SEM --g| 2.8.t| Transmission electron microscopy --g| 2.9.t| TEM imaging modes --g| 2.10.t| TEM spectroscopy --g| 2.11.t| Key applications of TEM --g| 2.12.t| Is electron microscopy a nondestructive technique? --g| 2.13.t| Outlook for SEM and TEM --t| References --g| 3.t| X-ray microtomography for materials characterization --g| 3.1.t| Introduction --g| 3.2.t| Imaging physics --g| 3.3.t| Principles of microcomputed tomography --g| 3.4.t| Geometrical considerations and data acquisition --g| 3.5.t| System design (CT methods) --g| 3.6.t| Image reconstruction --g| 3.7.t| Image quality --g| 3.8.t| Radiation exposure --g| 3.9.t| Examples of important and/or frequent applications for materials characterization --g| 3.10.t| Conclusions and future trends --g| 3.11.t| Further literature --t| References --g| 4.t| X-ray diffraction (XRD) techniques for materials characterization --g| 4.1.t| Introduction --g| 4.2.t| Principles of X-ray diffraction techniques --g| 4.3.t| Applications --g| 4.4.t| Conclusions and future trends --t| References --t| Further reading --g| 5.t| Microwave, millimeter wave and terahertz (MMT) techniques for materials characterization --g| 5.1.t| Introduction --g| 5.2.t| Principles of MMT techniques --g| 5.3.t| Applications --g| 5.4.t| Conclusions --g| 5.5.t| Future trends --t| References --g| 6.t| Acoustic microscopy for materials characterization --g| 6.1.t| Introduction --g| 6.2.t| Basic principles --g| 6.3.t| Resolution and contrast mechanisms --g| 6.4.t| Tessonics AM1103 acoustical microscope --g| 6.5.t| Materials characterization for industrial applications --g| 6.6.t| Scanning acoustic microscopy inspection of spot welds --g| 6.7.t| Real-time imaging of seam welds --g| 6.8.t| Imaging of adhesive bonding between various metals --g| 6.9.t| Adhesive bonding of composite and biocomposite materials --g| 6.10.t| Conclusions --t| References --g| 7.t| Ultrasonic techniques for materials characterization --g| 7.1.t| Introduction --g| 7.2.t| Principles of ultrasonic technique --g| 7.3.t| Applications --g| 7.4.t| Conclusions --g| 7.5.t| Future trends --t| References --g| 8.t| Electromagnetic techniques for materials characterization --g| 8.1.t| Introduction --g| 8.2.t| Principles of electromagnetic techniques --g| 8.3.t| Applications --g| 8.4.t| Conclusions --g| 8.5.t| Future trends --t| References --g| 9.t| Hybrid methods for materials characterization --g| 9.1.t| Introduction --g| 9.2.t| Signal processing and analysis on the way toward software-defined nondestructive testing devices --g| 9.3.t| Calibration procedure --g| 9.4.t| Applications --g| 9.5.t| Conclusions --g| 9.6.t| Future trends --t| References.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Nondestructive testing.=| ^A23224;

650 0 a| Materialsx| Analysis.=| ^A65583;

650 7 a| Materialsx| Analysis2| fast0| (OCoLC)fst01011773;

650 7 a| Nondestructive testing.2| fast0| (OCoLC)fst01430903;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Huebschen, Gerhard.?| UNAUTHORIZED;

830 0 a| Woodhead Publishing series in electronic and optical materialsv| no. 88.=| ^A1315546;

856 40 z| Full text available from eBook - Materials Science 2016 [EBCMS16]u| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fwww.sciencedirect.com%2Fscience%2Fbook%2F9780081000403;

947 a| (OCoLC)ocn932174125;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL77;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC60;

596 a| 1 3 4;

998 a| 5244783;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5244783-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 2/13/2020x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5244783-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 2/13/2020x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5244783-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 2/13/2020x| EBOOKz| JERESOURCE;

Materials characterization using nondestructive evaluation (NDE) methods / edited by Gerhard Hübschen [and 3 others].

Other author	Huebschen, Gerhard.
Format	Electronic
Publication Info	Amsterdam ; Boston : Elsevier/Woodhead Publishing, [2016]
Description	xv, 303 pages : illustrations (some color) 24 cm.
Supplemental Content	Full text available from eBook - Materials Science 2016 [EBCMS16]
Subjects	Nondestructive testing. Materials--Analysis.

Series	Woodhead Publishing series in electronic and optical materials ; number 88 Woodhead Publishing series in electronic and optical materials no. 88. ^A1315546
Contents	Machine generated contents note: 1. Atomic force microscopy (AFM) for materials characterization -- 1.1. Introduction -- 1.2. Comparison of AFM with other microscopy techniques -- 1.3. Principles of AFM technique -- 1.4. Construction and basic components of AFM -- 1.5. Working modes of AFM -- 1.6. Application of AFM for material characterization -- 1.7. Conclusions -- Acknowledgments -- References -- 2. Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) for materials characterization -- 2.1. Introduction -- 2.2. Why electron microscopy? -- 2.3. Types of microscopes -- 2.4. Interaction of electrons with materials -- 2.5. What material features can we analyze using electron microscopy? -- 2.6. Scanning electron microscopy -- 2.7. Key microstructural features analyzed by SEM -- 2.8. Transmission electron microscopy -- 2.9. TEM imaging modes -- 2.10. TEM spectroscopy -- 2.11. Key applications of TEM -- 2.12. Is electron microscopy a nondestructive technique? -- 2.13. Outlook for SEM and TEM -- References -- 3. X-ray microtomography for materials characterization -- 3.1. Introduction -- 3.2. Imaging physics -- 3.3. Principles of microcomputed tomography -- 3.4. Geometrical considerations and data acquisition -- 3.5. System design (CT methods) -- 3.6. Image reconstruction -- 3.7. Image quality -- 3.8. Radiation exposure -- 3.9. Examples of important and/or frequent applications for materials characterization -- 3.10. Conclusions and future trends -- 3.11. Further literature -- References -- 4. X-ray diffraction (XRD) techniques for materials characterization -- 4.1. Introduction -- 4.2. Principles of X-ray diffraction techniques -- 4.3. Applications -- 4.4. Conclusions and future trends -- References -- Further reading -- 5. Microwave, millimeter wave and terahertz (MMT) techniques for materials characterization -- 5.1. Introduction -- 5.2. Principles of MMT techniques -- 5.3. Applications -- 5.4. Conclusions -- 5.5. Future trends -- References -- 6. Acoustic microscopy for materials characterization -- 6.1. Introduction -- 6.2. Basic principles -- 6.3. Resolution and contrast mechanisms -- 6.4. Tessonics AM1103 acoustical microscope -- 6.5. Materials characterization for industrial applications -- 6.6. Scanning acoustic microscopy inspection of spot welds -- 6.7. Real-time imaging of seam welds -- 6.8. Imaging of adhesive bonding between various metals -- 6.9. Adhesive bonding of composite and biocomposite materials -- 6.10. Conclusions -- References -- 7. Ultrasonic techniques for materials characterization -- 7.1. Introduction -- 7.2. Principles of ultrasonic technique -- 7.3. Applications -- 7.4. Conclusions -- 7.5. Future trends -- References -- 8. Electromagnetic techniques for materials characterization -- 8.1. Introduction -- 8.2. Principles of electromagnetic techniques -- 8.3. Applications -- 8.4. Conclusions -- 8.5. Future trends -- References -- 9. Hybrid methods for materials characterization -- 9.1. Introduction -- 9.2. Signal processing and analysis on the way toward software-defined nondestructive testing devices -- 9.3. Calibration procedure -- 9.4. Applications -- 9.5. Conclusions -- 9.6. Future trends -- References.
Bibliography note	Includes bibliographical references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	2017304826
ISBN	9780081000403 (hbk.)
ISBN	0081000405 (hbk.)

Materials characterization using nondestructive evaluation (NDE) methods / edited by Gerhard Hübschen [and 3 others].

Click here for more information about this title