/LC.GIF&client=easterncarolinaedu)
Modeling and simulation for microelectronic packaging assembly manufacturing, reliability, and testing / Sheng Liu, Yong Liu.
| Author/creator | Liu, S., 1963- |
| Other author | Liu, Yong (Micro-optoelectronic mechanical systems professor) |
| Format | Electronic |
| Publication Info | [Beijing] : Chemical Industry Press ; Singapore : Wiley, |
| Description | xxii, 564 p. : ill. ; 26 cm. |
| Supplemental Content | Full text available from Ebook Central - Academic Complete |
| Subjects |
| Abstract | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher. |
| Bibliography note | Includes bibliographical references and index. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2011019534 |
| ISBN | 9780470827802 (hardback) |
| ISBN | 0470827807 (hardback) |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |