Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao.
| Author/creator | Zhang, Hengyun |
| Other author | Che, Faxing. |
| Other author | Lin, Tingyu. |
| Other author | Zhao, Wensheng. |
| Format | Electronic |
| Publication Info | Oxford : Woodhead Publishing, 2019. |
| Description | xvi, 418 pages : illustrations ; 23 cm |
| Supplemental Content | Full text available from eBook - Engineering 2019 |
| Subjects |
| Series | Woodhead Publishing series in electronic and optical materials |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Issued in other form | ebook version : 9780081025338 |
| Genre/form | Electronic books. |
| LCCN | 2020303682 |
| ISBN | 9780081025321 (pbk.) : |
| ISBN | 0081025327 |