2005 International Conference on Thermal, Mechanical and Multiphysics Simulation and Experience in Micro-electronics and Micro-systems
| Author/creator | Ernst, L. J. Author |
| Other author | Components, Packaging & Manufacturing Technology Society Staff. |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | Piscataway : I E E E |
| Description | xvi, 706 p. ill |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Supplemental Content | Full text available from IEEE Conference Proceedings Archive 2005-2009 |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Subjects |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2006530083 |
| ISBN | 9780780390621 |
| ISBN | 0780390628 (Trade Paper) Active Record |
| Stock number | EX1050 00066573 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | ✔ Available |