IEEE International Symposium and Exhibition on Advanced Packaging Materials processes, properties and interfaces : March 15-17, 2006, Atlanta, GA.
| Author/creator | International Symposium on Advanced Packaging Materials |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | [New York, N.Y.] : Institute of Electrical and Electronics Engineers, |
| Description | 200 p. : ill. ; 28 cm. |
| Supplemental Content | Full text available from IEEE Conference Proceedings Archive 2005-2009 |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Subjects |
| Portion of title | Advanced packaging materials |
| Variant title | IEEE CPMT |
| General note | Product Number 06TH8875. |
| Bibliography note | Includes bibliographical references. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| Other title | Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on. |
| LCCN | 2007277001 |
| ISBN | 1424402603 |
| ISBN | 9781424402601 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | ✔ Available |