Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE 2007 / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT.

Author/creator EuroSimE 2007
Other author Ernst, L. J.
Other author Components, Packaging & Manufacturing Technology Society.
Other author IEEE Xplore (Online service)
Format Electronic
Publication InfoPiscataway, NJ : IEEE,
Descriptionxvi, 767 p. : ill. ; 30 cm.
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Supplemental ContentFull text available from IEEE Conference Proceedings Archive 2005-2009
Subjects
Microelectronics--Simulation methods. --Congresses.
Systems engineering--Simulation methods. --Congresses.

Portion of title EuroSimE 2007
Cover title 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Cover title Proceedings of EuroSimE 2007
General note"IEEE catalog number 05EX1050"--P. ii.
Bibliography noteIncludes bibliographical references.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 2007922208
ISBN142441105X (softbound ed.)