Tools

LEADER 04590cas 2200853 i 4500

001 ssj0036650;

003 WaSeSS;

005 20251212090320.0;

006 m d ;

007 cr n ;

008 100414c19989999njuar s 1 a0eng ;

010 a| 2020205038;

016 7 a| 0092087022| Uk;

022 a| 2694-2135y| 1936-3958y| 1089-98702| 1;

029 1 a| AU@b| 000043828178;

029 1 a| AU@b| 000044921033;

029 1 a| AU@b| 000045707911;

029 1 a| AU@b| 000051312056;

029 1 a| NZ1b| 12134439;

029 1 a| NZ1b| 14155628;

029 1 a| NZ1b| 14557647;

029 1 a| NZ1b| 16178155;

029 1 a| AU@b| 000068324985;

035 a| (WaSeSS)ssj0036650;

037 b| IEEE, 445 Hoes Lane, PO Box 1331, Piscataway, NJ 08855-1331;

042 a| dlra| pcca| nsdp;

049 a| EREEa| NEHH;

050 00 a| TK7870.25;

082 10 a| 621.3812| 231| https://id.oclc.org/worldcat/ddc/E3P8PCWB9MXFKmXtPgPD3pFVBb;

111 2 a| InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems,j| issuing body=| ^A726222;

210 0 a| ITHERMb| (InterSoc. Conf. Thermal Thermomechanical Phenom. Electron. Syst. Online);

222 0 a| ITHERMb| (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Online);

240 10 a| ITHERM (Online)=| ^A726222;

245 10 a| ITHERMh| [electronic resource] /c| Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.;

246 1 i| Some volumes have title:a| Proceedings;

246 13 a| I-THERM;

246 13 a| ITHERM ... proceedingsf| 2000;

246 1 a| ... Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems;

246 1 a| Proceedings of the ... Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems;

260 a| Piscataway, NJ :b| IEEE,c| ℗♭1998-;

310 a| Annual,b| 2016-;

321 a| Biennial;

362 1 a| Began with: 6th (1998).;

500 a| Imprint varies.;

506 a| Available only to authorized users.;

530 a| Also available in print.;

538 a| Mode of access: World Wide Web.;

550 a| Sponsored by the: Components, Packaging, and Manufacturing Technology Society, 1998-;

583 1 a| digitizedc| 2010h| HathiTrust Digital Libraryl| committed to preserve2| pda5| MiAaHDL;

588 a| Description based on: 6th (1998); title from PDF cover page (IEEE Xplore, viewed September 29, 2020).;

588 a| Latest issue consulted: (2019) (IEEE Xplore, viewed September 29, 2020).;

650 0 a| Electronic apparatus and appliancesx| Thermal propertiesv| Congresses.=| ^A906403;

650 0 a| Electronic apparatus and appliancesx| Design and constructionv| Congresses.=| ^A725777;

650 0 a| Heatx| Transmissionv| Congresses.=| ^A586712;

710 2 a| Components, Packaging & Manufacturing Technology Society.1| https://id.oclc.org/worldcat/entity/E39QH7JmpbhGgyjdbbxkJMgTTR.=| ^A724956;

710 2 a| IEEE Xplore (Online service)=| ^A534875;

850 a| DLC;

856 40 z| Click here for full textu| http://JW3MH2CM6N.search.serialssolutions.com/?V=1.0&L=JW3MH2CM6N&S=JCs&C=INTECONFONT&T=marc;

947 a| (OCoLC)607427184;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER123;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL79;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC61;

583 1 a| digitizedc| 2010h| HathiTrust Digital Libraryl| committed to preserve2| pda5| MiAaHDL;

596 a| 1 3 4;

998 a| 6226023;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6226023-1001l| JNETm| JOYNERr| Ys| Yt| JNESSJOu| 9/13/2023x| EJOURNALz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6226023-2001l| HSLELECm| HSLr| Ys| Yt| HELECu| 9/13/2023x| EJOURNALz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6226023-3001l| MNETm| JMUSICr| Ys| Yt| MNESSJOu| 9/13/2023x| EJOURNALz| JERESOURCE;

ITHERM / Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Author/creator	InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Other author	Components, Packaging & Manufacturing Technology Society.
Other author	IEEE Xplore (Online service)
Format	Electronic
Publication Info	Piscataway, NJ : IEEE, ℗♭1998-
Supplemental Content	Click here for full text
Subjects	Electronic apparatus and appliances--Thermal properties. --Congresses. Electronic apparatus and appliances--Design and construction. --Congresses. Heat--Transmission. --Congresses.

Uniform title	ITHERM (Online)
Variant title	Some volumes have title: Proceedings
Other title	I-THERM
Other title	ITHERM ... proceedings 2000
Variant title	... Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Variant title	Proceedings of the ... Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Frequency	Annual, 2016-
General note	Imprint varies.
Access restriction	Available only to authorized users.
Other forms	Also available in print.
Technical details	Mode of access: World Wide Web.
Issuing body	Sponsored by the: Components, Packaging, and Manufacturing Technology Society, 1998-
Action note	digitized 2010 HathiTrust Digital Library committed to preserve
Action note	digitized 2010 HathiTrust Digital Library committed to preserve
Action note	digitized 2010 HathiTrust Digital Library committed to preserve
Action note	digitized 2010 HathiTrust Digital Library committed to preserve
Action note	digitized 2010 HathiTrust Digital Library committed to preserve
Source of description	Description based on: 6th (1998); title from PDF cover page (IEEE Xplore, viewed September 29, 2020).
Source of description	Latest issue consulted: (2019) (IEEE Xplore, viewed September 29, 2020).
Preceding title	InterSociety Conference on Thermal Phenomena in Electronic Systems. I-THERM 2577-0799
Issued in other form	Print version: InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. ITHERM 1936-3958
LCCN	2020205038
ISSN	2694-2135 1936-3958 1089-9870
Stock number	IEEE, 445 Hoes Lane, PO Box 1331, Piscataway, NJ 08855-1331

Availability

Library	Location	Call Number	Status	Item Actions
	Electronic Resources	Access Content Online	✔ Available

ITHERM / Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Click here for more information about this title

Availability