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111 2 a| IEEE International 3D Systems Integration Conference.?| UNAUTHORIZED;

210 0 a| IEEE Int. 3D Syst. Integr. Conf.b| (Online);

222 0 a| IEEE International 3D Systems Integration Conferenceb| (Online);

240 10 a| IEEE International 3D Systems Integration Conference (Online)?| UNAUTHORIZED;

245 10 a| IEEE International 3D Systems Integration Conferenceh| [electronic resource].;

246 13 a| 3DIC;

246 10 a| 3D Systems Integration Conference;

246 1 i| Some online providers have title:a| 3D System Integration ... 3DIC ... IEEE International Conference on;

246 1 a| IEEE 3D Systems Integration Conference;

260 a| [Piscataway, NJ] :b| IEEE,c| 2009-;

310 a| Annual;

362 1 a| Began in 2009.;

500 a| None published 2012, 2017-2018.;

506 a| Available only to authorized users.;

530 a| Also available in print.;

538 a| Mode of access: World Wide Web.;

588 0 a| Print version record.;

588 1 a| 2021 (IEEE Xplore, viewed February 22, 2023).;

650 0 a| Three-dimensional integrated circuitsv| Congresses.=| ^A1172761;

650 0 a| Integrated circuitsx| Design and constructionv| Congresses.=| ^A534337;

650 0 a| Three-dimensional imagingv| Congresses.=| ^A1157012;

655 0 a| Electronic journals.=| ^A353035;

710 2 a| Institute of Electrical and Electronics Engineers.=| ^A9546;

710 2 a| IEEE Xplore (Online service)=| ^A534875;

856 40 z| Click here for full textu| http://JW3MH2CM6N.search.serialssolutions.com/?V=1.0&L=JW3MH2CM6N&S=JCs&C=TC0002922023&T=marc;

947 a| (OCoLC)892820566;

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999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6276483-2001l| HSLELECm| HSLr| Ys| Yt| HELECu| 11/14/2023x| EJOURNALz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6276483-3001l| MNETm| JMUSICr| Ys| Yt| MNESSJOu| 11/14/2023x| EJOURNALz| JERESOURCE;

IEEE International 3D Systems Integration Conference

Author/creator	IEEE International 3D Systems Integration Conference
Other author	Institute of Electrical and Electronics Engineers.
Other author	IEEE Xplore (Online service)
Format	Electronic
Publication Info	[Piscataway, NJ] : IEEE, 2009-
Supplemental Content	Click here for full text
Subjects	Three-dimensional integrated circuits--Congresses. Integrated circuits--Design and construction. --Congresses. Three-dimensional imaging--Congresses.

Uniform title	IEEE International 3D Systems Integration Conference (Online)
Other title	3DIC
Portion of title	3D Systems Integration Conference
Variant title	Some online providers have title: 3D System Integration ... 3DIC ... IEEE International Conference on
Variant title	IEEE 3D Systems Integration Conference
Frequency	Annual
General note	None published 2012, 2017-2018.
Access restriction	Available only to authorized users.
Other forms	Also available in print.
Technical details	Mode of access: World Wide Web.
Source of description	Print version record.
Source of description	2021 (IEEE Xplore, viewed February 22, 2023).
Issued in other form	Print version: IEEE International 3D Systems Integration Conference. IEEE International 3D Systems Integration Conference 2164-0157
Genre/form	Electronic journals.
LCCN	2016247548
ISSN	2836-4902 2164-0157

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	Electronic Resources	Access Content Online	✔ Available

IEEE International 3D Systems Integration Conference

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