European Microelectronics and Packaging Conference [proceedings].
| Author/creator | European Microelectronics and Packaging Conference |
| Other author | Institute of Electrical and Electronics Engineers. |
| Other author | International Microelectronics and Packaging Society. |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | Piscataway, NJ : Institute of Electrical and Electronic Engineers ; Red Hook, NY : Available from Curran Associates |
| Supplemental Content | Click here for full text |
| Subjects |
| Uniform title | European Microelectronics and Packaging Conference (Online) |
| Variant title | EMPC |
| Variant title | May also be called: European Microelectronics Packaging Conference |
| Frequency | Biennial |
| Access restriction | Available only to authorized users. |
| Special numbering | Issued in parts. |
| Other forms | Also available in print. |
| Technical details | Mode of access: World Wide Web. |
| Title history note | Alternates years with the similarly titled biennial Symposium. |
| Source of description | Description based on: 2009; title from title page. |
| Source of description | Latest issue consulted: 2009. |
| Related Item | European Microelectronics and Packaging Symposium. Proceedings |
| Genre/form | Electronic journals. |
| LCCN | 2011206305 |
| ISSN | 2165-2341 |
| Stock number | IEEE Service Center, 445 Hoes Lane, Piscataway, NJ 08854-4141 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |