Tools

LEADER 03636cas 2200673 a 4500

001 ssj0055174;

003 WaSeSS;

005 20260312090335.0;

006 m d ;

007 cr n ;

008 890410d19891995nyuar s 1 a0eng c;

010 a| 92660520 z| sn 89013292;

016 7 a| 0158267672| DE-101;

016 7 a| 1050821-12| DE-600;

022 0 a| 1063-22042| 1;

023 0 a| 1063-22042| 1;

029 1 a| AU@b| 000009225088;

029 1 a| AU@b| 000012891583;

029 1 a| AU@b| 000053469906;

030 a| PCWIFE;

035 a| (WaSeSS)ssj0055174;

037 b| IEEE Computer Society Press, 10662 Los Vaqueros Cr., Los Alamitos, CA 90720-1264;

042 a| pcca| nsdp;

049 a| EREEa| NEHH;

050 00 a| TK7874b| .I578a;

082 00 a| 621.38152| 201| https://id.oclc.org/worldcat/ddc/E3tRB36988v8qcwvjc4THvhCWY;

111 2 a| International Conference on Wafer Scale Integration.=| ^A728281;

210 0 a| Proc. - Int. Conf. Wafer Scale Integr.;

222 0 a| Proceedings - International Conference on Wafer Scale Integration;

240 10 a| Proceedings (Online)=| ^A728281;

245 10 a| Proceedingsh| [electronic resource] /c| International Conference on Wafer Scale Integration.;

260 a| Washington, D.C. :b| IEEE Computer Society Press,c| ℗♭1989-℗♭1995.;

310 a| Annual;

362 0 a| Jan. 3-5, 1989-7th (1995).;

500 a| Published: Los Alamitos, Calif., 1992; New York, N.Y., 1993-1995.;

506 a| Available only to authorized users.;

515 a| Issues for 1989-1995 also called 1st-7th.;

530 a| Also available in print.;

538 a| Mode of access: World Wide Web.;

550 a| Conferences for 1989-1993 sponsored by the IEEE Computer Society and the IEEE Components, Hybrids, and Manufacturing Technology Society; 1994-1995 with the IEEE Components, Packaging, and Manufacturing Technology Society.;

650 0 a| Integrated circuitsx| Wafer-scale integrationv| Congresses.=| ^A855755;

655 0 a| Electronic journals.=| ^A353035;

710 2 a| IEEE Computer Society.1| https://id.oclc.org/worldcat/entity/E39QQPVp7YRxjbcrXVPYHxVD3F.=| ^A53823;

710 2 a| IEEE Components, Hybrids, and Manufacturing Technology Society.1| https://id.oclc.org/worldcat/entity/E39QH7JmpvGC6dqrmgdwXYcQ3F.=| ^A723462;

710 2 a| Components, Packaging & Manufacturing Technology Society.1| https://id.oclc.org/worldcat/entity/E39QH7JmpbhGgyjdbbxkJMgTTR.=| ^A724956;

710 2 a| IEEE Xplore (Online service)=| ^A534875;

785 00 a| International Conference on Innovative Systems in Silicon.t| Proceedingsw| (DLC) 97659021w| (OCoLC)35842264;

856 40 z| Click here for full textu| http://JW3MH2CM6N.search.serialssolutions.com/?V=1.0&L=JW3MH2CM6N&S=JCs&C=PICOW&T=marc;

947 a| (OCoLC)19527230;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER123;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL79;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC61;

596 a| 1 3 4;

998 a| 6375760;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6375760-1001l| JNETm| JOYNERr| Ys| Yt| JNESSJOu| 6/13/2024x| EJOURNALz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6375760-2001l| HSLELECm| HSLr| Ys| Yt| HELECu| 6/13/2024x| EJOURNALz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6375760-3001l| MNETm| JMUSICr| Ys| Yt| MNESSJOu| 6/13/2024x| EJOURNALz| JERESOURCE;

Proceedings / International Conference on Wafer Scale Integration.

Author/creator	International Conference on Wafer Scale Integration
Format	Electronic
Publication Info	Washington, D.C. : IEEE Computer Society Press, ℗♭1989-℗♭1995.
Supplemental Content	Click here for full text
Subjects	Integrated circuits--Wafer-scale integration. --Congresses.

Other author/creator	IEEE Computer Society. https://id.oclc.org/worldcat/entity/E39QQPVp7YRxjbcrXVPYHxVD3F.
Other author/creator	IEEE Components, Hybrids, and Manufacturing Technology Society. https://id.oclc.org/worldcat/entity/E39QH7JmpvGC6dqrmgdwXYcQ3F.
Other author/creator	Components, Packaging & Manufacturing Technology Society. https://id.oclc.org/worldcat/entity/E39QH7JmpbhGgyjdbbxkJMgTTR.
Other author/creator	IEEE Xplore (Online service)
Uniform title	Proceedings (Online)
Frequency	Annual
General note	Published: Los Alamitos, Calif., 1992; New York, N.Y., 1993-1995.
Access restriction	Available only to authorized users.
Special numbering	Issues for 1989-1995 also called 1st-7th.
Other forms	Also available in print.
Technical details	Mode of access: World Wide Web.
Issuing body	Conferences for 1989-1993 sponsored by the IEEE Computer Society and the IEEE Components, Hybrids, and Manufacturing Technology Society; 1994-1995 with the IEEE Components, Packaging, and Manufacturing Technology Society.
Succeeding title	International Conference on Innovative Systems in Silicon. Proceedings
Genre/form	Electronic journals.
LCCN	92660520 sn 89013292
ISSN	1063-2204
Stock number	IEEE Computer Society Press, 10662 Los Vaqueros Cr., Los Alamitos, CA 90720-1264

Proceedings / International Conference on Wafer Scale Integration.

Click here for more information about this title