Proceedings of ... International Symposium on High Density Packaging and Microsystem Integration
| Author/creator | International Symposium on High Density Packaging and Microsystem Integration |
| Other author | Institute of Electrical and Electronics Engineers. |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | Piscataway, NJ : Institute of Electrical and Electronic Engineers |
| Supplemental Content | Click here for full text |
| Subjects |
| Uniform title | Proceedings of ... International Symposium on High Density Packaging and Microsystem Integration (Online) |
| Portion of title | HDP |
| Other title | Proceedings of HDP |
| Other title | Proceedings HDP |
| Other title | International Symposium on High Density Packaging and Microsystem Integration |
| Variant title | IEEE Xplore title: High Density packaging and Microsystem Integration ... HDP ... International Symposium on |
| Access restriction | Available only to authorized users. |
| Other forms | Also available in print. |
| Technical details | Mode of access: World Wide Web. |
| Source of description | Description based on print version record. |
| Preceding title | IEEE CPMT Conference on High Density Microsystem Design and Packaging Component Failure Analysis. IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis |
| In | IEEE/IEE electronic library |
| Issued in other form | Also in print: International Symposium on High Density Packaging and Microsystem Integration. Proceedings of ... International Symposium on High Density Packaging and Microsystem Integration 2151-2248 |
| Genre/form | Electronic journals. |
| LCCN | 2009204162 |
| ISSN | 2151-2256 |
| Stock number | Institute of Electrical and Electronics Engineers, IEEE Operations Center, 445 Hoes Lane, Piscataway, NJ 08854 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |