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Cover image for Current activities in standardization of high-temperature, low-cycle-fatigue testing techniques in the United States

Current activities in standardization of high-temperature, low-cycle-fatigue testing techniques in the United States

  • by Verrilli, Michael J.
  • 1990
  • Format: Microform
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Cover image for High temperature fatigue behavior of tungsten copper composites

High temperature fatigue behavior of tungsten copper composites

  • by Verrilli, Michael J.
  • 1990
  • Format: Microform
Location
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Cover image for Thermomechanical fatigue behavior of materials

Thermomechanical fatigue behavior of materials

  • 1996
  • Format: Electronic
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Cover image for Characterization of failure processes in tungsten copper composites under fatigue loading conditions

Characterization of failure processes in tungsten copper composites under fatigue loading conditions

  • by Kim, Yŏng-suk
  • 1989
  • Format: Microform
Location
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Cover image for High temperature tension-compression fatigue behavior of a tungsten copper composite

High temperature tension-compression fatigue behavior of a tungsten copper composite

  • by Verrilli, Michael J.
  • 1991
  • Format: Microform
Location
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