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Cover image for 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

  • 2005
  • Format: Electronic
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Cover image for 2017 14th International Conference the Experience of Designing and Application of CAD Systems in Microelectronics (CADSM)

2017 14th International Conference the Experience of Designing and Application of CAD Systems in Microelectronics (CADSM)

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Cover image for 2015 13th International Conference the Experience of Designing and Application of CAD Systems in Microelectronics (CADSM)

2015 13th International Conference the Experience of Designing and Application of CAD Systems in Microelectronics (CADSM)

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Cover image for Third IEEE International Workshop on Electronic Design, Test, and Applications : proceedings, 17-19 January 2006, Kuala Lumpur, Malaysia

Third IEEE International Workshop on Electronic Design, Test, and Applications : proceedings, 17-19 January 2006, Kuala Lumpur, Malaysia

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Cover image for Introduction to system-on-package (SOP)

Introduction to system-on-package (SOP)

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Cover image for Dosvid rozrobky ta zastosuvanni͡a prylado-tekhnolohichnykh SAPR v mikroelektronit͡si

Dosvid rozrobky ta zastosuvanni͡a prylado-tekhnolohichnykh SAPR v mikroelektronit͡si

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Cover image for Dosvid rozrobky ta zastosuvanni͡a prylado-tekhnolohichnykh SAPR v mikroelektronit͡si

Dosvid rozrobky ta zastosuvanni͡a prylado-tekhnolohichnykh SAPR v mikroelektronit͡si

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Cover image for Experience of designing and application of CAD systems in microelectronics

Experience of designing and application of CAD systems in microelectronics

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Cover image for Experience of designing and application of CAD systems in microelectronics

Experience of designing and application of CAD systems in microelectronics

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Cover image for Microelectronics

Microelectronics

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Joyner - General Stacks TK7874 .M527 ✔ Available