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Cover image for Nevv-Englands plantation. Or, A short and true description of the commodities and discommodities of that countrey. Written by Mr. Higgeson, a reuerend diuine now there resident. Whereunto is added a letter, sent by Mr. Graues an enginere, out of New-England

Nevv-Englands plantation. Or, A short and true description of the commodities and discommodities of that countrey. Written by Mr. Higgeson, a reuerend diuine now there resident. Whereunto is added a letter, sent by Mr. Graues an enginere, out of New-England

by Higginson, Francis
1630
Format: Electronic

Location
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Cover image for Nevv-Englands plantation. Or, A short and true description of the commodities and discommodities of that countrey. Written by Mr. Higgeson, a reuerend diuine now there resident. Whereunto is added a letter, sent by Mr. Graues an enginere, out of New-England

Nevv-Englands plantation. Or, A short and true description of the commodities and discommodities of that countrey. Written by Mr. Higgeson, a reuerend diuine now there resident. Whereunto is added a letter, sent by Mr. Graues an enginere, out of New-England

by Higginson, Francis
1630
Format: Electronic

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Cover image for Development of a new seal for use on large openings of pressurized spacecraft

Development of a new seal for use on large openings of pressurized spacecraft

by Weddendorf, B.
1994
Format: Book

Location	Call #	Status
Joyner - Microforms B300	NAS 1.15:108444	✔ Available

Cover image for Via regia ad geometriam. = The vvay to geometry

Via regia ad geometriam. = The vvay to geometry

by Ramus, Petrus
1636
Format: Electronic

Location
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Cover image for International Symposium on Electronic Materials and Packaging (EMAP2000)

International Symposium on Electronic Materials and Packaging (EMAP2000)

by EMAP2000
2000
Format: Electronic

Location
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