"Microelectronic packaging" - ECU Libraries Catalog

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Cover image for European Microelectronics and Packaging Conference

European Microelectronics and Packaging Conference

by European Microelectronics and Packaging Conference
2005
Format: Electronic

Location
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Cover image for Proceedings of ... International Symposium on High Density Packaging and Microsystem Integration

Proceedings of ... International Symposium on High Density Packaging and Microsystem Integration

by International Symposium on High Density Packaging and Microsystem Integration
2007
Format: Electronic

Location
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Cover image for LCP for microwave packages and modules

LCP for microwave packages and modules

2012
Format: Book

Location	Call #	Status
Joyner - General Stacks	TK7876 .L387 2012	✔ Available

Cover image for ... IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics and ... IEEE Interdisciplinary Conference on Portable Information Devices

... IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics and ... IEEE Interdisciplinary Conference on Portable Information Devices

by IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics
2005
Format: Electronic

Location
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Cover image for Semiconductor packaging

Semiconductor packaging

by Chen, Andrea
2012
Format: Electronic

Location
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Cover image for Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics

Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics

by International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
2007
Format: Electronic

Location
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Cover image for Polytronic 2005

Polytronic 2005

by International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
2006
Format: Electronic

Location
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Cover image for 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

by International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
2004
Format: Electronic

Location
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Cover image for POLYTRONIC 2002

POLYTRONIC 2002

by International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
2002
Format: Electronic

Location
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Cover image for The effect of imports of ceramic semiconductor packages on the national security

The effect of imports of ceramic semiconductor packages on the national security

by United States
1993
Format: Microform

Location	Call #	Status
Joyner - Microforms B300	C 63.2:IM 7/4	✔ Available