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Showing 1 - 6 of 6 results
Search Results
Microelectronic ultrasonic bonding
| Location | Call # | Status |
|---|---|---|
| Joyner - Fed Docs Stacks | C 13.10:400-2 | ✔ Available |
Electromagnetic-acoustic-transducer/synthetic-aperture system for thick-weld inspection
| Location | Call # | Status |
|---|---|---|
| Joyner - Microforms B300 | C 13.46:1075 | ✔ Available |
Microelectronic interconnection bonding with ribbon wire
| Location | Call # | Status |
|---|---|---|
| Joyner - Fed Docs Stacks | C 13.46:767 | ✔ Available |
Application of capacitor microphones and magnetic pickups to the tuning and trouble shooting of microelectronic ultrasonic bonding equipment
| Location | Call # | Status |
|---|---|---|
| Joyner - Fed Docs Stacks | C 13.46:573 | ✔ Available |
