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Cover image for Microelectronic test pattern NBS-3 for evaluating the resistivity-dopant density relationship of silicon

Microelectronic test pattern NBS-3 for evaluating the resistivity-dopant density relationship of silicon

Location Call # Status
Joyner - Fed Docs Stacks C 13.10:400-22 ✔ Available
Cover image for Metallic inks for solar cells

Metallic inks for solar cells

  • 2013
  • Format: Electronic
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Cover image for Relationship of recombination lifetime and dark current in silicon p-n junctions

Relationship of recombination lifetime and dark current in silicon p-n junctions

  • 2005
  • Format: Electronic
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Cover image for Accelerated stress testing, qualification testing, HAST, field experience - what do they all mean?

Accelerated stress testing, qualification testing, HAST, field experience - what do they all mean?

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Cover image for Planar test structures for characterizing impurities in silicon

Planar test structures for characterizing impurities in silicon

  • 1976
  • Format: Book
Location Call # Status
Joyner - Fed Docs Stacks C 13.10:400-21 ✔ Available
Cover image for Tensile properties and microstructural characterization of Hi-Nicalon SiC/RBSN composites

Tensile properties and microstructural characterization of Hi-Nicalon SiC/RBSN composites

Location Call # Status
Joyner - Microforms B300 NAS 1.15:208657 ✔ Available
Cover image for Design and testing guides for the CMOS and lateral bipolar-on-SOI test library

Design and testing guides for the CMOS and lateral bipolar-on-SOI test library

Location Call # Status
Joyner - Microforms B300 C 13.10:400-93 ✔ Available
Cover image for Evaluation of a porous silicon carbide resistive start catalyst on a methanol-fueled vehicle

Evaluation of a porous silicon carbide resistive start catalyst on a methanol-fueled vehicle

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Cover image for Semiconductor measurement technology

Semiconductor measurement technology

Location Call # Status
Joyner - Fed Docs Stacks C 13.10:400-48 ✔ Available
Cover image for Imaging study of multi-crystalline silicon wafers throughout the manufacturing process

Imaging study of multi-crystalline silicon wafers throughout the manufacturing process

  • 2011
  • Format: Electronic
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