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Cover image for Microelectronic test pattern NBS-3 for evaluating the resistivity-dopant density relationship of silicon

Microelectronic test pattern NBS-3 for evaluating the resistivity-dopant density relationship of silicon

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Joyner - Fed Docs Stacks C 13.10:400-22 ✔ Available
Cover image for Hermeticity testing of MEMS and microelectronic packages

Hermeticity testing of MEMS and microelectronic packages

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Cover image for Microelectronic processing laboratory at NBS

Microelectronic processing laboratory at NBS

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Joyner - Fed Docs Stacks C 13.10:400-53 ✔ Available
Cover image for 2015 International Conference on Microelectronic Test Structures (ICMTS)

2015 International Conference on Microelectronic Test Structures (ICMTS)

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Cover image for Third IEEE International Workshop on Electronic Design, Test, and Applications : proceedings, 17-19 January 2006, Kuala Lumpur, Malaysia

Third IEEE International Workshop on Electronic Design, Test, and Applications : proceedings, 17-19 January 2006, Kuala Lumpur, Malaysia

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Cover image for Techniques for measuring the integrity of passivation overcoats on integrated circuits

Techniques for measuring the integrity of passivation overcoats on integrated circuits

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Joyner - Fed Docs Stacks C 13.10:400-31 ✔ Available
Cover image for Digital holography for MEMS and microsystem metrology

Digital holography for MEMS and microsystem metrology

  • 2011
  • Format: Electronic
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Cover image for Photo-excited processes, diagnostics, and applications

Photo-excited processes, diagnostics, and applications

  • 2003
  • Format: Electronic
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Cover image for New approaches to image processing based failure analysis of nano-scale ULSI devices

New approaches to image processing based failure analysis of nano-scale ULSI devices

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Cover image for Proceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits

Proceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits

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